Diamond Lapping Compound

Diamond Lapping Compound – Technical Specification Sheet

Product Overview

Braemar USA’s Diamond Lapping Compound provides accurate and stable material removal on hard and brittle substrates. The compound uses high-purity diamond that is micronized to strict tolerances; therefore, particle size remains uniform. Because of this consistency, the cutting rate stays predictable and the scratch pattern remains controlled. Moreover, the precise grading reduces micro-fracture and supports low-damage polishing. In addition, each syringe contains 18 grams of compound, which improves dosing accuracy and limits contamination during handling. Consequently, users achieve more consistent polishing results across a wide range of materials.

Carrier System Engineering

The carrier system is designed to disperse diamond particles evenly; therefore, viscosity remains stable throughout the process. Additionally, the formulation resists heat and prevents particle agglomeration. As a result, a smooth polishing film is maintained across the workpiece. Furthermore, the stable behavior improves performance on manual plates, semi-automatic stations, and advanced automated platforms. Consequently, operators experience predictable results even during extended cycles.

Oil-Based Carrier

• Maintains viscosity at elevated temperatures; therefore, it performs well under heavy pressure.

• Moreover, improved chip evacuation reduces galling on carbide and hardened steels.

• Additionally, the formulation holds its film under aggressive passes, which supports rapid stock removal.

• Consequently, the oil-based option is preferred for demanding lapping environments.

Water-Based Carrier

• Suited for oxide, nitride, and fluoride materials; therefore, it works well on sapphire, alumina, fused silica, quartz, and semiconductor wafers.

• Furthermore, the low-residue formula simplifies post-polish cleaning.

• Moreover, reduced contamination risk improves suitability for precision optical and semiconductor operations.

• Consequently, it is ideal for clean, sensitive finishing environments.

Micron Size Range & Polishing Behavior

Braemar USA offers micron sizes from 1 µm to 60 µm. Because of this range, users can match each grade to a specific polishing stage.

Fine Grades (1–6 µm)

• Produce optical-level finishes; moreover, they minimize subsurface damage.

• Consequently, these grades support the final polishing stages.

Mid Grades (9–15 µm)

• Improve geometry and reduce surface roughness; therefore, they prepare substrates for fine finishing.

• Additionally, they help stabilize surface quality before final passes.

Coarse Grades (30–60 µm)

• Provide fast material removal; furthermore, they maintain cutting stability under higher loads.

• Consequently, they are effective for shaping and pre-polish leveling.

Because each micron grade is tightly controlled, users achieve predictable and repeatable results across the full lapping and polishing sequence.

Call (480) 966-9311 or Add to Quote for pricing.