1A8SP Precision Resin Bond Diamond Slotting Wheel

1A8SP Precision Resin Bond Diamond Slotting Wheels are specifically engineered for high-precision slot grinding of quartz wafer carriers (boats) used throughout the semiconductor and solar industries. Designed to deliver exceptional edge quality, tight dimensional control, and reduced chipping, these wheels provide consistent performance in demanding quartz fabrication applications.

Manufactured with premium diamond abrasive and a precision resin bond system, the 1A8SP design offers excellent cutting action while maintaining superior surface finishes on fused quartz and other brittle materials. The wheel geometry is optimized for deep slotting applications where accuracy, rigidity, and coolant flow are critical to achieving clean slot profiles and long tool life.

Available in 6″, 7″, 8″, and 10″ diameters, these wheels can be supplied in thicknesses ranging from .015″ to .250″, allowing for both ultra-thin precision slots and wider groove applications. Custom specifications are also available to meet individual machine and process requirements.

When used with our precision cup-style flanges, the wheel assembly provides exceptional rigidity and minimal runout, enabling operators to grind slots as close as .100″ from the end of the quartz carrier. This maximizes usable part area while improving slot location accuracy and repeatability.